The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
May. 23, 2012
Kiminori Ozaki, Kariya, JP;
Yasuhiro Koike, Kariya, JP;
Hiroaki Asano, Kariya, JP;
Harumitsu Sato, Kariya, JP;
Hiroki Watanabe, Kariya, JP;
Tadayoshi Kachi, Kariya, JP;
Takahiro Suzuki, Kariya, JP;
Hitoshi Shimadu, Kariya, JP;
Tetsuya Furuta, Kariya, JP;
Masao Miyake, Kariya, JP;
Takahiro Hayakawa, Nagoya, JP;
Tomoaki Asai, Nagoya, JP;
Ryou Yamauchi, Hashima, JP;
Kiminori Ozaki, Kariya, JP;
Yasuhiro Koike, Kariya, JP;
Hiroaki Asano, Kariya, JP;
Harumitsu Sato, Kariya, JP;
Hiroki Watanabe, Kariya, JP;
Tadayoshi Kachi, Kariya, JP;
Takahiro Suzuki, Kariya, JP;
Hitoshi Shimadu, Kariya, JP;
Tetsuya Furuta, Kariya, JP;
Masao Miyake, Kariya, JP;
Takahiro Hayakawa, Nagoya, JP;
Tomoaki Asai, Nagoya, JP;
Ryou Yamauchi, Hashima, JP;
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, Aichi-ken, JP;
Abstract
An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.