The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Jan. 10, 2014
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Tomotake Nashiki, Osaka, JP;

Motoki Haishi, Osaka, JP;

Tomonori Noguchi, Osaka, JP;

Kuniaki Ishibashi, Osaka, JP;

Daisuke Kajihara, Osaka, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06F 3/041 (2006.01); H01L 31/18 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); G06F 3/041 (2013.01); H01L 31/1884 (2013.01); H05K 1/09 (2013.01); G06F 2203/04103 (2013.01); H05K 2201/0326 (2013.01); Y02E 10/50 (2013.01);
Abstract

There is provided a transparent conductive film which comprises: a film substrate; a plurality of transparent conductor patterns formed on the film substrate; and a pressure-sensitive adhesive layer wherein the transparent conductor patterns are embedded. The plurality of transparent conductor patterns respectively have a two-layer structure wherein a first indium tin oxide layer and a second indium tin oxide layer are laminated on the film substrate in this order, and the first indium tin oxide layer has a greater tin oxide content than the second indium tin oxide layer does. The first indium tin oxide layer has a smaller thickness than the second indium tin oxide layer does.


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