The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Sep. 20, 2013
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo-to, JP;
Inventors:
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo-to, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 51/52 (2006.01); C08G 73/10 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); C08G 73/1042 (2013.01); H01L 51/529 (2013.01); H01L 51/5218 (2013.01); H01L 23/3735 (2013.01); H01L 2251/5315 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 μm to 20 μm.