The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Nov. 02, 2010
Jitesh Shah, Fremont, CA (US);
Jitesh Shah, Fremont, CA (US);
INTEGRATED DEVICE TECHNOLOGY, INC., San Jose, CA (US);
Abstract
An integrated circuit () that is electrically connected to a printed circuit board () with a package substrate () includes a circuit body (), and a bump array () that electrically connects the circuit body () to the package substrate (). The bump array () includes a first bump set () having a plurality of signal bumps () and a plurality of non-signal bumps () alternatingly interspersed and aligned along an axis. With the present design, the bump array () allows each signal bump () to be surrounded by a power bump () and a ground bump (). The package substrate () includes (i) a package body (); and (ii) a pin array () that includes a first pin set () that includes a plurality of signal pins () and a plurality of non-signal pins () alternatingly interspersed and aligned along an axis.