The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Aug. 05, 2013
Jia-yu Hung, Taipei, TW;
Chang-yuan Wu, Taipei, TW;
I-feng Hsu, Taipei, TW;
Ting-wei Hsu, Taipei, TW;
Jia-Yu Hung, Taipei, TW;
Chang-Yuan Wu, Taipei, TW;
I-Feng Hsu, Taipei, TW;
Ting-Wei Hsu, Taipei, TW;
COMPAL ELECTRONICS, INC., Taipei, TW;
Abstract
A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.