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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9332599 B1

PDFFull Text
Date of Patent:
May. 03, 2016

Filed:

Jan. 15, 2014

Circuit board for supporting semiconductor light-emitting device mounted thereon, light-emitting module, lighting apparatus, and lighting system

Applicant:

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Inventors:

Akeo Kasakura, Chiyoda-ku, JP;

Shuuji Onaka, Chiyoda-ku, JP;

Toru Takeda, Chiyoda-ku, JP;

Yoshihito Satou, Chiyoda-ku, JP;

Assignee:

MITSUBISHI CHEMICAL CORPORATION, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P

Primary Examiner:

Douglas W Owens

Assistant Examiner:

Jonathan Cooper

Int. Cl.
CPC ...
H05B 33/08 (2006.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H05K 1/05 (2006.01); F21V 29/00 (2015.01); F21V 5/00 (2015.01); F21V 5/04 (2006.01); F21Y 101/02 (2006.01); F21Y 113/00 (2016.01); H05K 1/02 (2006.01); F21K 99/00 (2016.01); F21Y 105/00 (2016.01); F21V 29/77 (2015.01);
U.S. Cl.
CPC ...
H05B 33/0803 (2013.01); F21V 29/004 (2013.01); H01L 25/0753 (2013.01); H01L 33/504 (2013.01); H05K 1/056 (2013.01); F21K 9/00 (2013.01); F21V 5/007 (2013.01); F21V 5/04 (2013.01); F21V 29/773 (2015.01); F21Y 2101/02 (2013.01); F21Y 2105/003 (2013.01); F21Y 2113/007 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0207 (2013.01); H05K 2201/10106 (2013.01);
Abstract

The present invention provides a technology related to an improvement in the performance of releasing heat generated in a semiconductor light-emitting device. In a light-emitting module including a semiconductor light-emitting device provided with at least a semiconductor light-emitting element and a phosphor, and a circuit board, on the circuit board, at least a semiconductor light-emitting device including a plurality of semiconductor light-emitting elements each having a different path of a drive current to be supplied thereto, or a plurality of semiconductor light-emitting devices each having a different path of a drive current to be supplied to the semiconductor light-emitting elements is mounted. The circuit board is provided with a base material portion formed using a heat-conducting material, and a power supply conductor layer for supplying the drive currents of the semiconductor light-emitting elements to the semiconductor light-emitting device. The power supply conductor layer is planarly formed using a heat-conducting material, so as to cover a planar surface of the base material portion, and the planar region of the power supply conductor layer is planarly divided by an insulator for each drive current path.

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