The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
May. 31, 2012
Applicants:
Yoshiki Sota, Osaka, JP;
Kazuo Tamaki, Osaka, JP;
Inventors:
Yoshiki Sota, Osaka, JP;
Kazuo Tamaki, Osaka, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 29/267 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2010.01); H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/36 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 24/97 (2013.01); H01L 33/62 (2013.01); H01L 33/36 (2013.01); H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01);
Abstract
Pkg resin crack is suppressed after dicing. A light emitting devicewhere a light emitting devicethat emits light is mounted on a lead frameand that uses a resin cavity molding packagehaving an integrally molded lead framesconstituting electrodes that correspond to the light emitting elementand resin, wherein roundness is given to a part or all of a cutting plane corner part of a retention section (hanger lead) that become a cause of crack generation due to the retention sections (hanger leads) of the lead frames giving stress concentration to resin at the time of cutting by a blade