The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Mar. 07, 2012
Applicants:

Matthias Sabathil, Regensburg, DE;

Andreas Plöβl, Regensburg, DE;

Hans-jürgen Lugauer, Sinzing, DE;

Alexander Linkov, Regensburg, DE;

Patrick Rode, Regensburg, DE;

Inventors:

Matthias Sabathil, Regensburg, DE;

Andreas Plöβl, Regensburg, DE;

Hans-Jürgen Lugauer, Sinzing, DE;

Alexander Linkov, Regensburg, DE;

Patrick Rode, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/26 (2010.01); H01L 33/50 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/26 (2013.01); H01L 33/502 (2013.01); H01L 33/0079 (2013.01);
Abstract

The invention relates to a light-emitting semiconductor component, comprising—a first semiconductor body (), which comprises an active zone () in which during the operation of the light-emitting semiconductor component electromagnetic radiation is generated, at least some of which leaves the first semiconductor body () through a radiation exit surface (), and—a second semiconductor body (), which is suitable for converting the electromagnetic radiation into converted electromagnetic radiation having a longer wavelength, wherein—the first semiconductor body () and the second semiconductor body () are produced separately from each other, —the second semiconductor body () is electrically inactive, and—the second semiconductor body () is in direct contact with the radiation exit surface () and is attached there to the first semiconductor body () without connecting means.


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