The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

May. 18, 2015
Applicant:

Renesas Electronics Corporation, Kanagawa, JP;

Inventors:

Ryo Niide, Kanagawa, JP;

Shinichi Yamada, Kanagawa, JP;

Yasuharu Ichinose, Kanagawa, JP;

Toshiya Nozawa, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 27/02 (2006.01); H01L 27/15 (2006.01); H01L 33/36 (2010.01); H01L 25/16 (2006.01); H01L 29/866 (2006.01); H01L 23/00 (2006.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 27/0248 (2013.01); H01L 24/32 (2013.01); H01L 25/167 (2013.01); H01L 27/15 (2013.01); H01L 29/866 (2013.01); H01L 33/36 (2013.01); H01L 33/44 (2013.01); H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device simplifies the manufacturing process. The device includes a protective chip which has a surface Zener diode to protect a light emitting chip with an LED formed therein from surge voltage. The protective chip is mounted over a wiring electrically coupled through a metal wire to an anode electrode coupled to a p-type semiconductor region whose conductivity type is the same as that of the semiconductor substrate of the chip. The anode electrode of the protective chip is electrically coupled to the back surface of the chip without PN junction, so even if the back surface is in contact with the wiring, no problem occurs with the electrical characteristics of the Zener diode. This eliminates the need to form an insulating film on the back surface of the chip to prevent contact between the back surface and the wiring, thus simplifying the manufacturing process.


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