The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Aug. 31, 2013
Applicants:

Manish Arora, Dublin, CA (US);

Nuwan Jayasena, Sunnyvale, CA (US);

Gabriel H. Loh, Bellevue, WA (US);

Michael J. Schulte, Austin, TX (US);

Inventors:

Manish Arora, Dublin, CA (US);

Nuwan Jayasena, Sunnyvale, CA (US);

Gabriel H. Loh, Bellevue, WA (US);

Michael J. Schulte, Austin, TX (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/427 (2013.01); H01L 24/01 (2013.01); H01L 24/80 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/01322 (2013.01);
Abstract

Various stacked semiconductor chip arrangements and methods of manufacturing the same are disclosed. In one aspect, an apparatus is provided that includes a first semiconductor chip, a second semiconductor chip mounted on the first semiconductor chip, and a first portion of a phase change material positioned in a first pocket associated with the first semiconductor chip or the second semiconductor chip to store heat generated by one or both of the first and second semiconductor chips.


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