The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Aug. 07, 2013
Applicant:
Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;
Inventors:
Takeshi Sunaga, Kyoto, JP;
Akihiro Kimura, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/568 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 23/3107 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip, and a terminal connected with the semiconductor chip. The terminal has a first surface and a second surface spaced from each other in a thickness direction. The semiconductor device also includes a sealing resin covering the semiconductor chip and the terminal. The sealing resin is so configured that the first surface of the terminal is exposed from the sealing resin. The terminal is formed with an opening to be filled with the sealing resin.