The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Jun. 03, 2009
Applicants:
Wolfgang Pahl, Munich, DE;
Karl Weidner, Munich, DE;
Inventors:
Wolfgang Pahl, Munich, DE;
Karl Weidner, Munich, DE;
Assignee:
Epcos AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); B81B 7/00 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); B81B 7/0048 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); B81B 2207/07 (2013.01); H01L 23/498 (2013.01); H01L 23/5387 (2013.01); H01L 24/80 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/24998 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/82007 (2013.01); H01L 2224/82102 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A chip () is arranged above a top side of a flexible support () and mechanically decoupled from the support. Electrical connections () of the chip are embodied using a planar connection technique. The chip can be separated from the support by an air gap or a base layer () composed of a soft or compressible material.