The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Oct. 13, 2014
Applicant:

Infineon Technologies Dresden Gmbh, Dresden, DE;

Inventors:

Thoralf Kautzsch, Dresden, DE;

Heiko Fröhlich, Radebeul, DE;

Mirko Vogt, Dresden, DE;

Maik Stegemann, Pesterwitz, DE;

Andre Röth, Dresden, DE;

Steffen Bieselt, Wehlen, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 29/04 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01L 29/84 (2013.01);
Abstract

Embodiments relate to integrated circuit sensors, and more particularly to sensors integrated in an integrated circuit structure and methods for producing the sensors. In an embodiment, a sensor device comprises a substrate; a first trench in the substrate; a first moveable element suspended in the first trench by a first plurality of support elements spaced apart from one another and arranged at a perimeter of the first moveable element; and a first layer arranged on the substrate to seal the first trench, thereby providing a first cavity containing the first moveable element and the first plurality of support elements.


Find Patent Forward Citations

Loading…