The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Apr. 08, 2010
Applicants:

Tohru Saitoh, Chiba, JP;

Takaaki Ukeda, Osaka, JP;

Kazunori Komori, Hyogo, JP;

Sadayoshi Hotta, Osaka, JP;

Inventors:

Tohru Saitoh, Chiba, JP;

Takaaki Ukeda, Osaka, JP;

Kazunori Komori, Hyogo, JP;

Sadayoshi Hotta, Osaka, JP;

Assignee:

JOLED INC., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 21/22 (2006.01); H01L 21/285 (2006.01); H01L 29/45 (2006.01); H01L 29/66 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28512 (2013.01); H01L 29/458 (2013.01); H01L 29/66765 (2013.01); H01L 27/1277 (2013.01);
Abstract

A thin-film transistor includes a substrate, a gate electrode over the substrate, an insulating layer over the gate electrode, and a semiconductor layer over the insulating layer. The semiconductor layer includes a channel region, a source region, and a drain region. A source electrode is over the source region, and a drain electrode is over the drain region. The source electrode and the drain electrode each comprise Ni and a metal other than Ni. The channel region, the source region, and the drain region comprise at least one of a polycrystalline silicon that is formed by crystallizing an amorphous silicon layer by thermally diffusing the Ni in the source electrode and the drain electrode into the semiconductor layer and a microcrystalline silicon that is formed by crystallizing an amorphous silicon layer by thermally diffusing the Ni in the source electrode and the drain electrode into the semiconductor layer.


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