The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Apr. 30, 2013
Applicants:

Mark G. Allen, Atlanta, GA (US);

Seong-o Choi, Atlanta, GA (US);

Jung-hwan Pauk, Atlanta, GA (US);

Xiaosong Wu, Atlanta, GA (US);

Yanzhu Zhao, Atlanta, GA (US);

Yong-kyu Yoon, Smyma, GA (US);

Swaminathan Rajaraman, Atlanta, GA (US);

Inventors:

Mark G. Allen, Atlanta, GA (US);

Seong-O Choi, Atlanta, GA (US);

Jung-Hwan Pauk, Atlanta, GA (US);

Xiaosong Wu, Atlanta, GA (US);

Yanzhu Zhao, Atlanta, GA (US);

Yong-Kyu Yoon, Smyma, GA (US);

Swaminathan Rajaraman, Atlanta, GA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 13/00 (2006.01); A61B 5/00 (2006.01); A61M 37/00 (2006.01); H05K 1/02 (2006.01); C25D 1/00 (2006.01); C25D 1/10 (2006.01); C25D 5/02 (2006.01); A61N 1/32 (2006.01); H05K 3/40 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H01B 13/00 (2013.01); A61B 5/685 (2013.01); A61M 37/0015 (2013.01); C25D 1/003 (2013.01); C25D 1/10 (2013.01); C25D 5/022 (2013.01); H05K 1/02 (2013.01); H05K 3/4007 (2013.01); A61B 2562/125 (2013.01); A61M 2037/0053 (2013.01); A61N 1/327 (2013.01); H05K 3/20 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0113 (2013.01); Y10T 428/298 (2015.01); Y10T 428/2958 (2015.01);
Abstract

Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.


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