The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Mar. 28, 2014
Applicant:

Eternal Chemical Co., Ltd., Kaohsiung, TW;

Inventors:

Wei-Kai Chen, Kaohsiung, TW;

Tu-Yi Wu, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01B 1/12 (2006.01); G03F 7/00 (2006.01); H01L 51/00 (2006.01); C08J 7/12 (2006.01); G02F 1/1343 (2006.01); C08G 73/02 (2006.01);
U.S. Cl.
CPC ...
H01B 1/12 (2013.01); C08J 7/12 (2013.01); G02F 1/13439 (2013.01); G03F 7/00 (2013.01); H01L 51/0015 (2013.01); C08G 73/0266 (2013.01); C08G 2261/3221 (2013.01); C08G 2261/3223 (2013.01); C08G 2261/51 (2013.01); C08G 2261/65 (2013.01); C08G 2261/72 (2013.01); H01L 51/0037 (2013.01);
Abstract

A passivation composition and use of the composition in a method of forming a conductive pattern are provided. The passivation composition includes an oxidizing agent, an inorganic base with a general formula M(OH)and a solvent, wherein M is a metal ion and n is the valence number of the metal ion. The method includes the following steps: (a) forming a polymer conductive layer on a substrate, wherein the polymer conductive layer is consisting of a first area and a second area. The first area is corresponding to a conductive area to be formed; and (b) passivating the second area by using the passivation composition to reduce the conductivity of the second area and form the conductive pattern on the substrate.


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