The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Nov. 19, 2014
Applicant:

Siemens Medical Solutions Usa, Inc., Malvern, PA (US);

Inventor:

Ronald E. Malmin, Chicago, IL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G21K 1/02 (2006.01); B23H 1/00 (2006.01); B23H 7/02 (2006.01); B23H 9/00 (2006.01); B23K 26/36 (2014.01); B23K 26/40 (2014.01);
U.S. Cl.
CPC ...
G21K 1/02 (2013.01); B23H 1/00 (2013.01); B23H 7/02 (2013.01); B23H 9/00 (2013.01); B23K 26/364 (2015.10); B23K 26/367 (2013.01); B23K 26/40 (2013.01); B23K 26/401 (2013.01); B23K 26/4015 (2013.01); G21K 1/025 (2013.01); B23K 2203/08 (2013.01); B23K 2203/50 (2015.10); Y10T 29/49826 (2015.01); Y10T 83/04 (2015.04); Y10T 83/0581 (2015.04);
Abstract

A photon collimator, suitable for use in medical imaging equipment, is constructed from a block of photon-attenuating material, such as solid tungsten or molybdenum alloy that defines a plurality of integrally formed septa slats. Each slat has an elongated length dimension greater than thickness and depth dimensions, and is oriented in an opposed pattern array that is laterally spaced relative to its respective thickness dimension. An aperture channel is defined between each pair of opposed slats. Rows of integrally formed slats in one block or separately affixed blocks may be stacked on each other at skewed angles to form two-dimensional grids of apertures having polygonal cross sections. The slats may be formed by electric discharge or laser thermal ablation machining, such as by a sequential passing of an EDM wire cutting head along the pattern array, repeating sequential cutting of respective channel depth and width.


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