The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Jan. 24, 2013
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Satoshi Matsuba, Nagoya, JP;

Tsukuru Mizuguchi, Otsu, JP;

Kazutaka Kusano, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); G03F 7/30 (2006.01); G03F 7/40 (2006.01); H01L 21/027 (2006.01); H05K 3/12 (2006.01); H01B 1/20 (2006.01); G03F 7/004 (2006.01); H01B 1/22 (2006.01); C09D 5/24 (2006.01); H05K 1/09 (2006.01); G03F 7/16 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); C09D 5/24 (2013.01); G03F 7/004 (2013.01); G03F 7/0047 (2013.01); G03F 7/168 (2013.01); H01B 1/22 (2013.01); H05K 1/095 (2013.01); H05K 3/02 (2013.01); H05K 2203/0514 (2013.01);
Abstract

A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitie component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.


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