The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9329471 B1

PDF
Full Text
Expired
Date of Patent:
May. 03, 2016

Filed:

Nov. 05, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Guoxiang Ning, Ballston Lake, NY (US);

Xintuo Dai, Clifton Park, NY (US);

Huang Liu, Mechanicville, NY (US);

Chin Teong Lim, Clifton Park, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/54 (2012.01); G03F 1/70 (2012.01); G03F 1/80 (2012.01); G03F 7/20 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G03F 1/70 (2013.01); G03F 1/54 (2013.01); G03F 1/80 (2013.01); G03F 7/20 (2013.01); G06F 17/5072 (2013.01); G06F 17/5081 (2013.01);
Abstract

Achieving a critical dimension target for a feature based on characteristics of a resist is facilitated. Mask data is established for fabricating a lithographic mask to expose different regions of a resist to high, low, and intermediate exposure levels. The resist is configured to exhibit high solubility when exposed to the high or low exposure level, and low solubility when exposed to the intermediate exposure level. A critical dimension for a region of the resist to be exposed to the intermediate exposure level is determined, and the mask data is established to indicate opaque regions for forming on the lithographic mask. The opaque regions are arrayed to facilitate exposing the region of the resist to the intermediate exposure level, to achieve the determined critical dimension. Further, a method is provided for forming in-situ a patterned mask from a mask layer above a substrate material.


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