The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Feb. 22, 2011
Applicants:

Tetsu Negishi, Osaka, JP;

Akihide Shibata, Osaka, JP;

Kenji Komiya, Osaka, JP;

Fumiyoshi Yoshioka, Osaka, JP;

Hiroshi Iwata, Osaka, JP;

Akira Takahashi, Osaka, JP;

Inventors:

Tetsu Negishi, Osaka, JP;

Akihide Shibata, Osaka, JP;

Kenji Komiya, Osaka, JP;

Fumiyoshi Yoshioka, Osaka, JP;

Hiroshi Iwata, Osaka, JP;

Akira Takahashi, Osaka, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Osaka-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 9/24 (2006.01); G02F 1/1335 (2006.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 33/06 (2010.01); H01L 33/18 (2010.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
G02F 1/133603 (2013.01); H01L 24/95 (2013.01); H01L 25/0753 (2013.01); G02F 1/133605 (2013.01); G02F 2001/133612 (2013.01); G02F 2001/133614 (2013.01); G02F 2001/133628 (2013.01); H01L 33/06 (2013.01); H01L 33/18 (2013.01); H01L 33/20 (2013.01); H01L 33/38 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/3025 (2013.01); H01L 2933/0041 (2013.01);
Abstract

A metal lineis formed in a linear area S of an insulative substrate, and moreover a metal lineis formed generally parallel to the metal linewith a specified distance thereto. The metal lineis connected to an n-type semiconductor coreof bar-like structure light-emitting elementsA toD, and the metal lineis connected to a p-type semiconductor layer. By dividing the insulative substrateinto a plurality of divisional substrates, a plurality of light-emitting devices in each of which a plurality of bar-like structure light-emitting elementsare placed on the divisional substrates are formed.


Find Patent Forward Citations

Negishi, Tetsu. (2016). Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device (U.S. Patent No. 9329433). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9329433

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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