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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9328900 B1

PDFFull Text
Date of Patent:
May. 03, 2016

Filed:

Aug. 17, 2011

Packaged led module

Applicants:

Peter Pachler, Graz, AT;

Janos Dobos, Szombathely, HU;

Roland Peinsipp, Gleisdorf, AT;

Inventors:

Peter Pachler, Graz, AT;

Janos Dobos, Szombathely, HU;

Roland Peinsipp, Gleisdorf, AT;

Assignees:

Tridonic Jennersdorf GmbH, Jennersdorf, AT;

Tridonic GmbH & Co. KG, Dombirn, AT;

Attorney:

The H.T. Than Law Group

Primary Examiner:

Laura Menz

Assistant Examiner:

Maliheh Malek

Int. Cl.
CPC ...
G02B 6/43 (2006.01); F21V 19/00 (2006.01); F21V 15/01 (2006.01); G02B 6/42 (2006.01); F21S 4/00 (2016.01); F21V 21/002 (2006.01); F21V 27/02 (2006.01); F21V 31/04 (2006.01); H01L 33/48 (2010.01); F21V 29/507 (2015.01); G09F 13/22 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
F21V 15/01 (2013.01); F21S 4/001 (2013.01); F21V 19/0035 (2013.01); F21V 21/002 (2013.01); F21V 27/02 (2013.01); F21V 29/507 (2015.01); F21V 31/04 (2013.01); G02B 6/4255 (2013.01); H01L 33/48 (2013.01); F21Y 2101/02 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The invention relates to a packaged LED module () comprising a module () having at least one LED () arranged thereon, and a one-piece package () having a receptacle for the module (), a substantially optically transmissive region (), which makes it possible to emit light from the LED () towards the outside, an opening () and potting blocking means (). The package () is embodied in such a way that a potting component is introduced via the opening () into the package () equipped with the module (). The introduced potting component forms a potting body (), which completely fills the package (), excluding a region between the LED () and the substantially optically transmissive region () on account of the potting blocking means (), and which connects the package (), the module () and connecting cables () that can be connected to the module () in an externally sealing manner.

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