The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Oct. 22, 2012
Applicant:
GM Global Technology Operations Llc, Detroit, MI (US);
Inventors:
Sampath K. Vanimisetti, Bangalore, IN;
Chen-Shih Wang, Warren, MI (US);
Vidyashankar R. Buravalla, Bangalore, IN;
Assignee:
GM Global Technology Operations, LLC, Detroit, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/32 (2006.01); C09J 11/04 (2006.01); C08K 7/24 (2006.01); B29K 105/16 (2006.01); B29C 65/48 (2006.01); B29C 65/00 (2006.01); B29C 61/00 (2006.01);
U.S. Cl.
CPC ...
C09J 11/04 (2013.01); B29C 61/00 (2013.01); B29C 65/487 (2013.01); B29C 65/489 (2013.01); B29C 65/4835 (2013.01); B29C 65/4855 (2013.01); B29C 66/006 (2013.01); B29C 66/721 (2013.01); B29C 66/7311 (2013.01); B29C 66/7315 (2013.01); B29C 66/73941 (2013.01); B29K 2105/165 (2013.01); B29K 2995/0096 (2013.01); C08K 7/24 (2013.01); Y10T 428/249984 (2015.04);
Abstract
A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.