The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Mar. 09, 2015
Applicant:

Kolo Technologies, Inc., San Jose, CA (US);

Inventor:

Yongli Huang, San Jose, CA (US);

Assignee:

Kolo Technologies, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/00 (2006.01); H03H 7/01 (2006.01); H03H 3/007 (2006.01); H03H 9/02 (2006.01); H03H 9/24 (2006.01); H03H 9/46 (2006.01); B81C 1/00 (2006.01); H02N 1/00 (2006.01); B81B 3/00 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00626 (2013.01); B81B 3/0027 (2013.01); B81C 1/00158 (2013.01); H02N 1/006 (2013.01); H03H 3/0072 (2013.01); H03H 9/02259 (2013.01); H03H 9/2405 (2013.01); H03H 9/462 (2013.01); H04R 19/005 (2013.01); B81C 1/00357 (2013.01); B81C 1/00373 (2013.01); B81C 1/00523 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49005 (2015.01);
Abstract

A capacitive micromachined ultrasound transducer (cMUT) and fabrication method of the same are provided. The cMUT has a substrate, a curved membrane disposed on top of the substrate, and a flexible membrane disposed on top of the curved membrane. The curved membrane has a raised portion which is higher than a recessed portion relative to the substrate, and is supported by a support standing on a major surface of the substrate. The flexible membrane includes a first region mounted to the raised portion of the curved membrane, and a second region extending over the recessed portion of the curved member. Methods for fabricating the cMUT are also disclosed.


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