The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Mar. 12, 2014
Applicant:

Versana Micro Inc., Scottsdale, AZ (US);

Inventor:

Bishnu Prasanna Gogoi, Scottsdale, AZ (US);

Assignee:

VERSANA MICRO INC, Scottsdale, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); H01L 27/14 (2006.01); H01L 27/22 (2006.01); H01L 27/16 (2006.01); H05K 7/02 (2006.01); H01L 41/113 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); H01L 27/14 (2013.01); H01L 27/16 (2013.01); H01L 27/22 (2013.01); H01L 41/1132 (2013.01); H01L 41/1138 (2013.01); H05K 7/02 (2013.01);
Abstract

A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.


Find Patent Forward Citations

Loading…