The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Mar. 08, 2014
Applicant:

Huhtamaki, Inc., De Soto, KS (US);

Inventors:

Ronald D. Robertson, Kansas City, MO (US);

James Edwin Winship, Lee's Summit, MO (US);

Assignee:

HUHTAMAKI, INC., De Soto, KS (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65D 3/22 (2006.01); B65D 81/38 (2006.01); B65D 1/26 (2006.01); B65D 21/02 (2006.01); A47G 23/02 (2006.01);
U.S. Cl.
CPC ...
B65D 81/3876 (2013.01); A47G 23/0216 (2013.01); B65D 1/265 (2013.01); B65D 3/22 (2013.01); B65D 21/0233 (2013.01); B65D 81/3869 (2013.01); B65D 81/3874 (2013.01);
Abstract

A multi-walled container comprising a receptacle and outer sleeve having an embossment formed therein is provided. An insulating layer may be defined or provided between the receptacle and outer sleeve. The outer sleeve has an embossment provided at least partially therearound for engaging the upper lip of a second container when multiple containers are nested or stacked one within another. The embossment may be a continuous circumferential rib formed around substantially the entire perimeter of the sleeve or may be a plurality of ribs formed intermittently around the perimeter of the sleeve. In order for the embossment to contact or engage the upper lip of another container, the embossment preferably has a diameter that is larger than a diameter of an opening defined by the receptacle upper lip. The outer sleeve can be fixedly attached to the insulating layer or receptacle at locations both above and below the embossment.


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