The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Mar. 27, 2012
Applicant:

Hiromi Sato, Tokyo, JP;

Inventor:

Hiromi Sato, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65C 9/46 (2006.01); B65C 11/02 (2006.01); B29C 65/48 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01); B32B 38/14 (2006.01); B65C 9/00 (2006.01); B31D 1/02 (2006.01);
U.S. Cl.
CPC ...
B65C 9/0015 (2013.01); B31D 1/021 (2013.01); B31D 1/025 (2013.01); Y10T 156/17 (2015.01);
Abstract

A label manufacturing apparatus manufactures a label L having a sub-label Lb bonded to a predetermined position on a main label La. A main label conveyance mechanismconveys a main continuous label strip Ta in a first direction Da. A sub-label conveyance mechanismconveys a sub-continuous label strip Tb in a second direction which crosses the first direction. The sub-labels Lb arranged in series on a backing strip Db, are separated from their backing strip and are each bonded to the surface of a respective main label La by a bonding mechanism. The completed display label L is separated from its backing strip Db of the main continuous label strip Ta. The label manufacturing apparatus can adjust the relative bonding position between the sub-label and the main label La so as to allow the sub-label bonding mechanismto bond the sub-label Lb to the main label La at a predetermined position.


Find Patent Forward Citations

Loading…