The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Aug. 22, 2012
Applicants:
Kenji Uchida, Kanagawa, JP;
Koki Hirasawa, Kanagawa, JP;
Inventors:
Kenji Uchida, Kanagawa, JP;
Koki Hirasawa, Kanagawa, JP;
Assignee:
RENESAS ELECTRONICS CORPORATION, Kawasaki-Shi, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); B29C 70/72 (2006.01); B29C 45/14 (2006.01); H01L 31/0203 (2014.01); H01L 31/18 (2006.01); H01L 23/00 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
B29C 70/72 (2013.01); B29C 45/14 (2013.01); B29C 45/14639 (2013.01); H01L 21/56 (2013.01); H01L 24/97 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/1815 (2013.01);
Abstract
A method for manufacturing an electronic device includes forming a resin film over a wafer, the wafer including a plurality of elements formed therein, each of the elements including a functional unit, patterning the resin film to form a plurality of frame members, each of the frame members being provided on each of the elements and surrounding the functional unit, dividing the wafer into the elements, and providing an encapsulation.