The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2016

Filed:

Dec. 11, 2015
Applicant:

Delaware Capital Formation, Inc., Wilmington, DE (US);

Inventors:

Kenneth D. Marino, Long Beach, CA (US);

Hoa Nguyen, Santa Ana, CA (US);

Assignee:

OK INTERNATIONAL INC., Garden Grove, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/00 (2006.01); B23K 3/02 (2006.01); B23K 3/08 (2006.01); B23K 3/047 (2006.01); B23K 3/03 (2006.01);
U.S. Cl.
CPC ...
B23K 3/08 (2013.01); B23K 3/02 (2013.01); B23K 3/03 (2013.01); B23K 3/033 (2013.01); B23K 3/0471 (2013.01); B23K 3/0478 (2013.01);
Abstract

An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.


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