The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Dec. 07, 2011
Tokihito Suwa, Hitachinaka, JP;
Yujiro Kaneko, Hitachinaka, JP;
Masashi Yura, Hitachinaka, JP;
Nobutake Tsuyuno, Tokai, JP;
Toshiaki Ishii, Hitachi, JP;
Junpei Kusukawa, Hitachinaka, JP;
Tokihito Suwa, Hitachinaka, JP;
Yujiro Kaneko, Hitachinaka, JP;
Masashi Yura, Hitachinaka, JP;
Nobutake Tsuyuno, Tokai, JP;
Toshiaki Ishii, Hitachi, JP;
Junpei Kusukawa, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
Provided is a power conversion device including an insulating member manufactured such that a thickness di (mm) of the insulating member made from a resin, provided between a heat dissipating surface of a conductor plate bonded to a power semiconductor device and a heat dissipating plate that dissipates the heat of the power semiconductor device satisfies a relation of di>(1.36×10-8×Vt2+3.4×10-5×Vt−0.015)×∈r, where a relative permittivity of the insulating member is ∈r and a surge voltage generated between the conductor plate and the heat dissipating plate accompanied by an ON/OFF switching operation of the power semiconductor device is Vt (V). The conductor plate of the power semiconductor device, the insulating member, and the heat dissipating plate are bonded by thermocompression bonding.