The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Oct. 07, 2010
Applicants:
Holger Scholzen, Stuttgart, DE;
Christoph Gmelin, Stuttgart, DE;
Jens Vollert, Muehlhausen, DE;
Markus Ellmer, Eisenach, DE;
Inventors:
Holger Scholzen, Stuttgart, DE;
Christoph Gmelin, Stuttgart, DE;
Jens Vollert, Muehlhausen, DE;
Markus Ellmer, Eisenach, DE;
Assignee:
ROBERT BOSCH GMBH, Stuttgart, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/04 (2006.01); H02B 1/00 (2006.01); H02B 1/56 (2006.01); H05K 7/20 (2006.01); H01S 4/00 (2006.01); H01L 21/00 (2006.01); H05K 13/00 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); G01L 19/14 (2013.01); G01L 19/148 (2013.01); H05K 13/00 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49175 (2013.01); Y10T 29/49002 (2015.01);
Abstract
A sensor has a sensor housing, an electronic component, and a sensor element. The electronic component and the sensor element are connected to one another in a media-tight manner. An adhesive which provides a seal is placed between bonding sites of a bonding wire of the at least one electrical connection.