The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Apr. 07, 2015
Applicant:

Finisar Corporation, Sunnyvale, CA (US);

Inventors:

Henry Meyer Daghighian, Redwood City, CA (US);

Steven C. Bird, San Jose, CA (US);

Assignee:

FINISAR CORPORATION, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); G02B 6/132 (2006.01); G02B 6/124 (2006.01); G02B 6/122 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); G02B 6/124 (2013.01); G02B 6/12007 (2013.01); G02B 6/1221 (2013.01); G02B 6/132 (2013.01); H05K 1/0207 (2013.01); H05K 1/028 (2013.01); H05K 1/032 (2013.01); H05K 1/115 (2013.01); G02B 2006/12164 (2013.01); H05K 2201/0154 (2013.01);
Abstract

A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.


Find Patent Forward Citations

Loading…