The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Oct. 08, 2012
Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventors:

Jun Yong Park, Ansan-si, KR;

Daewoong Suh, Ansan-si, KR;

Bo Ram I Jang, Ansan-si, KR;

Hee Cheul Jung, Ansan-si, KR;

Kyu Ho Lee, Ansan-si, KR;

Chang Hoon Kim, Ansan-si, KR;

Assignee:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/54 (2010.01); H01L 33/52 (2010.01); H01L 33/44 (2010.01); H01L 33/62 (2010.01); H01L 33/22 (2010.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 33/22 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.


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