The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Sep. 24, 2012
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Matthias Sabathil, Regensburg, DE;

Andreas Ploessl, Regensburg, DE;

Norwin von Malm, Nittendorf, DE;

Alexander Linkov, Regensburg, DE;

Lutz Hoeppel, Alteglofsheim, DE;

Christopher Koelper, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/20 (2010.01); H01L 33/00 (2010.01); H01L 31/02 (2006.01); H01L 31/0232 (2014.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 33/22 (2010.01);
U.S. Cl.
CPC ...
H01L 33/48 (2013.01); H01L 33/20 (2013.01); H01L 31/0232 (2013.01); H01L 33/22 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/58 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0041 (2013.01);
Abstract

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip and an optical element. A connecting layer includes a transparent oxide arranged between the semiconductor chip and the optical element. The connecting layer directly adjoins the semiconductor chip and the optical element and fixes the optical element on the semiconductor chip. A method for fabricating an optoelectronic semiconductor component is furthermore specified.


Find Patent Forward Citations

Loading…