The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Aug. 04, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Jong In Yang, Gyeonggi-Do, KR;

Yong Il Kim, Gyeonggi-Do, KR;

Kwang Min Song, Gyeonggi-Do, KR;

Wan Tae Lim, Gyeonggi-Do, KR;

Se Jun Han, Gyeonggi-Do, KR;

Hyun Kwon Hong, Chungcheongnam-Do, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/00 (2010.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0075 (2013.01); H01L 27/156 (2013.01); H01L 33/382 (2013.01); H01L 33/62 (2013.01); H01L 33/20 (2013.01); H01L 33/38 (2013.01); H01L 33/44 (2013.01); H01L 2224/16 (2013.01); H01L 2933/0016 (2013.01);
Abstract

A semiconductor light emitting device includes a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first internal electrode, a second internal electrode, an insulating part, and first and second pad electrodes. The active layer is disposed on a first portion of the first conductive semiconductor layer, and has the second conductive layer disposed thereon. The first internal electrode is disposed on a second portion of the first conductive semiconductor layer separate from the first portion. The second internal electrode is disposed on the second conductive semiconductor layer. The insulating part is disposed between the first and second internal electrodes, and the first and second pad electrodes are disposed on the insulating part to connect to a respective one of the first and second internal electrodes.


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