The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Jun. 20, 2011
Applicants:

Tsuneo Hamaguchi, Chiyoda-ku, JP;

Yoshimi Yabugaki, Chiyoda-ku, JP;

Daisuke Echizenya, Chiyoda-ku, JP;

Shinsuke Miyamoto, Chiyoda-ku, JP;

Inventors:

Tsuneo Hamaguchi, Chiyoda-ku, JP;

Yoshimi Yabugaki, Chiyoda-ku, JP;

Daisuke Echizenya, Chiyoda-ku, JP;

Shinsuke Miyamoto, Chiyoda-ku, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/05 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0504 (2013.01); H01L 31/0508 (2013.01); H01L 31/0512 (2013.01); Y02E 10/50 (2013.01);
Abstract

A plurality of thin linear thin wire electrodes are formed entirely over a first surface that is a light receiving surface of a solar cell element, a back surface collecting electrode is formed on a second surface that is a back surface of the solar cell element, and a wiring member which draws power is connected to each of the thin wire electrode and the back surface collecting electrode. The thin wire electrode and the wiring member are bonded with solder and side surfaces of the solder bonding portion in a longitudinal direction along the wiring member are coated with a thermosetting resin, and, in a region excluding the thin wire electrodes, the wiring member and the first surface are bonded with a thermosetting resin. The wiring member and the thin wire electrodes are bonded to have a sufficient mechanical bonding strength and high bonding reliability.


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