The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Apr. 10, 2014
Applicant:
Nichia Corporation, Anan-shi, Tokushima, JP;
Inventor:
Hiroaki Tamemoto, Anan, JP;
Assignee:
NICHIA CORPORATION, Anan-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B23K 26/00 (2014.01); H01L 29/06 (2006.01); B28D 5/00 (2006.01); H01L 21/78 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 29/0657 (2013.01); B23K 26/0006 (2013.01); B23K 26/0057 (2013.01); B23K 26/0072 (2013.01); B28D 5/0011 (2013.01); B23K 2201/40 (2013.01); B23K 2203/56 (2015.10); H01L 21/78 (2013.01); H01L 33/0095 (2013.01);
Abstract
A semiconductor element includes a substrate and a semiconductor layer. The substrate has a first main face and a second main face. The semiconductor layer is formed on a side of one of the first main face and the second main face of the substrate. The substrate has a plurality of isolated processed portions and an irregularity face that runs from the processed portions at least to the first main face of the substrate and links adjacent ones of the processed portions.