The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Dec. 17, 2014
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Hiroaki Niimi, Cohoes, NY (US);

Manoj Mehrotra, Bangalore, IN;

Rick L. Wise, Fairview, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 27/092 (2006.01); H01L 21/8238 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0924 (2013.01); H01L 21/823807 (2013.01); H01L 21/823821 (2013.01); H01L 29/16 (2013.01); H01L 29/20 (2013.01);
Abstract

An integrated circuit containing an n-channel finFET and a p-channel finFET has a dielectric layer over a silicon substrate. The fins of the finFETs have semiconductor materials with higher mobilities than silicon. A fin of the n-channel finFET is on a first silicon-germanium buffer in a first trench through the dielectric layer on the substrate. A fin of the p-channel finFET is on a second silicon-germanium buffer in a second trench through the dielectric layer on the substrate. The fins extend at least 10 nanometers above the dielectric layer. The fins are formed by epitaxial growth on the silicon-germanium buffers in the trenches in the dielectric layer, followed by CMP planarization down to the dielectric layer. The dielectric layer is recessed to expose the fins. The fins may be formed concurrently or separately.


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