The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Aug. 26, 2014
Applicants:
Mi-na Choi, Yongin-si, KR;
Seran Bae, Yongin-si, KR;
Yunhyeok Im, Hwaseong-si, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 21/4853 (2013.01); H01L 23/36 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 24/20 (2013.01); H01L 24/29 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/211 (2013.01); H01L 2224/28105 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29444 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/18161 (2013.01);
Abstract
In a package-on-package (PoP) device according to the inventive concepts, an anisotropic conductive film is disposed between a lower semiconductor package and an upper semiconductor package to remove an air gap between the lower and upper semiconductor packages. Thus, heat generated from a lower semiconductor chip may be rapidly and smoothly transmitted toward the upper semiconductor package, thereby increasing or maximizing a heat exhaust effect of the PoP device.