The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Nov. 27, 2013
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, CN;

Inventors:

Minghu Qi, Shenzhen, CN;

Chun Hao Wu, Shenzhen, CN;

Kun Hsien Lin, Shenzhen, CN;

Yongqiang Wang, Shenzhen, CN;

Zhiyou Shu, Shenzhen, CN;

Weibing Yang, Shenzhen, CN;

Zenghong Chen, Shenzhen, CN;

Guokun Yang, Shenzhen, CN;

Chenyangzi Li, Shenzhen, CN;

Yunshao Jiang, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01); G02F 1/133 (2006.01); H01L 23/538 (2006.01); G02F 1/1345 (2006.01); H01L 23/498 (2006.01); G02F 1/13 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); G02F 1/13306 (2013.01); G02F 1/13454 (2013.01); H01L 23/4985 (2013.01); H01L 23/5387 (2013.01); H01L 24/75 (2013.01); G02F 1/1303 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/97 (2013.01); Y10T 156/1052 (2015.01);
Abstract

The present invention provides a chip-on-film (COF) tape and a corresponding COF bonding method. The COF tape comprises a base tape, a plurality of first COFs and second COFs, the first and second COFs are arranged on the base tape in an alternating manner, and are correspondingly punched onto a moving platform by a punching mechanism, and are respectively bonded onto two side edges of a liquid crystal panel. The present invention can simultaneously process the bonding operations of the two types of COF by using only one COF tape and one set of equipment, thus lowering the cost and increasing the productivity.


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