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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9324663 B1

PDFFull Text
Date of Patent:
Apr. 26, 2016

Filed:

May. 08, 2014

Semiconductor device including a plurality of magnetic shields

Applicant:

Renesas Electronics Corporation, Kawasaki-shi, JP;

Inventors:

Takahito Watanabe, Kawasaki, JP;

Shintaro Yamamichi, Kawasaki, JP;

Yoshitaka Ushiyama, Kawasaki, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Attorney:

McGinn IP Law Group, PLLC

Primary Examiner:

Long K Tran

Assistant Examiner:

Dzung Tran

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 29/82 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/58 (2006.01); H01L 23/13 (2006.01); H01L 27/22 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/58 (2013.01); H01L 23/13 (2013.01); H01L 23/552 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 27/224 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/97 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2916 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/97 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1435 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract

A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, a side surface arranged between the first main surface and the second main surface, and a magnetic storage device, a first magnetic shield overlaying on the first main surface, a second magnetic shield overlaying on the second main surface, and a third magnetic shield overlaying on the side surface. The first and second magnetic shields are mechanically connected via the third magnetic shield.

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