The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Feb. 14, 2012
Applicants:
Noboru Miyamoto, Tokyo, JP;
Masao Kikuchi, Tokyo, JP;
Inventors:
Noboru Miyamoto, Tokyo, JP;
Masao Kikuchi, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 23/29 (2006.01); H01L 23/40 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/29 (2013.01); H01L 23/36 (2013.01); H01L 23/40 (2013.01); H01L 23/4334 (2013.01); H01L 23/49562 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01);
Abstract
A cooling finis joined to a semiconductor element. A resinencapsulates the semiconductor element. A portion of the cooling finprojects from a lower surface of the resin. A coolerhas an opening. The cooling finprojecting from the resinis inserted in the openingof the cooler. The lower surface of the resinand the coolerare joined to each other by a joining materialsuch as an adhesive. Therefore, a reduction in the number of component parts and a reduction in weight can be achieved, and compatibility between the heat conductivity and the strength of joining can be ensured.