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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9324628 B1

PDFFull Text
Expired
Date of Patent:
Apr. 26, 2016

Filed:

Feb. 25, 2014

Integrated circuit heat dissipation using nanostructures

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Alan B. Botula, Essex Junction, VT (US);

Max L. Lifson, Burlington, VT (US);

James A. Slinkman, Montpelier, VT (US);

Theodore G. Van Kessel, Millbrook, NY (US);

Randy L. Wolf, Essex Junction, VT (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Steven Meyers

Roberts Mlotkowski Safran & Cole, P.C.

Primary Examiner:

Mohsen Ahmadi

Assistant Examiner:

Frederick B Hargrove

Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 23/373 (2006.01); H01L 29/78 (2006.01); H01L 29/45 (2006.01); H01L 23/525 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 23/367 (2006.01); B82Y 10/00 (2011.01); H01L 29/417 (2006.01); H01L 29/06 (2006.01); H01L 29/41 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3731 (2013.01); B82Y 10/00 (2013.01); H01L 21/02112 (2013.01); H01L 21/02178 (2013.01); H01L 21/02189 (2013.01); H01L 21/2855 (2013.01); H01L 21/28518 (2013.01); H01L 21/28568 (2013.01); H01L 23/3677 (2013.01); H01L 23/5256 (2013.01); H01L 29/0676 (2013.01); H01L 29/413 (2013.01); H01L 29/41725 (2013.01); H01L 29/45 (2013.01); H01L 29/78 (2013.01);
Abstract

An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.

Find Patent Forward Citations

Botula, Alan. (2016). Integrated circuit heat dissipation using nanostructures (U.S. Patent No. 9324628). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9324628

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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