The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Apr. 04, 2012
Korbinian Perzlmaier, Regensburg, DE;
Heribert Zull, Regensburg, DE;
Franz Eberhard, Regensburg, DE;
Thomas Veit, Mintraching, DE;
Mathias Kämpf, Burglengenfeld, DE;
Jens Dennemarck, Regensburg, DE;
Korbinian Perzlmaier, Regensburg, DE;
Heribert Zull, Regensburg, DE;
Franz Eberhard, Regensburg, DE;
Thomas Veit, Mintraching, DE;
Mathias Kämpf, Burglengenfeld, DE;
Jens Dennemarck, Regensburg, DE;
Abstract
A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has, at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of: removing the transmissive layer within the separating region, applying an absorbent layer within the separating region, increasing the absorption coefficient of the transmissive layer within the separating region, and separating the chip regions along the separating regions by a laser.