The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Jul. 16, 2008
Hiromitsu Maruyama, Tokyo, JP;
Shuzo Taguchi, Tokyo, JP;
Noboru Sakuma, Tokyo, JP;
Yasumasa Morishima, Tokyo, JP;
Shinichi Ishiwata, Tokyo, JP;
Hiromitsu Maruyama, Tokyo, JP;
Shuzo Taguchi, Tokyo, JP;
Noboru Sakuma, Tokyo, JP;
Yasumasa Morishima, Tokyo, JP;
Shinichi Ishiwata, Tokyo, JP;
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Abstract
A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.