The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Jul. 13, 2015
Applicants:

International Business Machines Corporation, Armonk, NY (US);

King Abdulaziz City for Science and Technology, Riyadh, SA;

Inventors:

Ibrahim Alhomoudi, Alhufof, SA;

Stephen W. Bedell, Wappingers Falls, NY (US);

Cheng-Wei Cheng, White Plains, NY (US);

Keith E. Fogel, Hopewell Junction, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Katherine L. Saenger, Ossining, NY (US);

Norma E. Sosa, New York, NY (US);

Ning Li, White Plains, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/268 (2006.01); H01L 21/311 (2006.01); H01L 21/683 (2006.01); H01L 21/3213 (2006.01); B23K 26/06 (2014.01); B23K 26/36 (2014.01); B23K 26/40 (2014.01);
U.S. Cl.
CPC ...
H01L 21/268 (2013.01); B23K 26/0624 (2015.10); B23K 26/0635 (2013.01); B23K 26/364 (2015.10); B23K 26/367 (2013.01); B23K 26/40 (2013.01); B23K 26/4075 (2013.01); H01L 21/31127 (2013.01); H01L 21/32131 (2013.01); H01L 21/6835 (2013.01); B23K 2203/50 (2015.10); H01L 2221/68327 (2013.01);
Abstract

Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled.


Find Patent Forward Citations

Loading…