The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Aug. 30, 2013
Applicants:

Laurent Meersseman, Kortrijk, BE;

Martin Segaert, Ieper, BE;

Bernard Thiers, Eine, BE;

Benjamin Clement, Waregem, BE;

Christophe Maesen, Lichtervelde, BE;

Inventors:

Laurent Meersseman, Kortrijk, BE;

Martin Segaert, Ieper, BE;

Bernard Thiers, Eine, BE;

Benjamin Clement, Waregem, BE;

Christophe Maesen, Lichtervelde, BE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 47/06 (2006.01); E04F 15/10 (2006.01); B32B 7/12 (2006.01); B32B 21/02 (2006.01); B32B 37/15 (2006.01); B32B 37/22 (2006.01); B44C 1/24 (2006.01); B44C 5/04 (2006.01); B32B 37/06 (2006.01); B32B 37/16 (2006.01); E04F 15/18 (2006.01); E04F 15/02 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
E04F 15/107 (2013.01); B29C 47/065 (2013.01); B32B 7/12 (2013.01); B32B 21/02 (2013.01); B32B 37/06 (2013.01); B32B 37/153 (2013.01); B32B 37/16 (2013.01); B32B 37/226 (2013.01); B44C 1/24 (2013.01); B44C 5/04 (2013.01); E04F 15/02038 (2013.01); E04F 15/10 (2013.01); E04F 15/18 (2013.01); B32B 38/145 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2309/105 (2013.01); B32B 2309/12 (2013.01); B32B 2310/0825 (2013.01); B32B 2327/06 (2013.01); B32B 2471/00 (2013.01); E04F 2201/0107 (2013.01); E04F 2201/023 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1039 (2015.01); Y10T 156/1084 (2015.01);
Abstract

In a method for manufacturing floor panels that have at least a substrate and a top layer provided on the substrate, the top layer including a thermoplastic layer that is translucent or transparent, the method may involve providing the top layer, including the thermoplastic layer, on the substrate. The method may also involve heating at least the thermoplastic layer, and structuring the thermoplastic layer using a mechanical press element.


Find Patent Forward Citations

Loading…