The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9322096 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 26, 2016

Filed:

May. 25, 2012
Applicants:

Thomas A. Yager, Encinitas, CA (US);

Joshua Robinson, University Park, PA (US);

Inventors:

Thomas A. Yager, Encinitas, CA (US);

Joshua Robinson, University Park, PA (US);

Assignee:

EMPIRE TECHNOLOGY DEVELOPMENT LLC, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); C23C 16/26 (2006.01); C23C 16/02 (2006.01); C23C 16/54 (2006.01);
U.S. Cl.
CPC ...
C23C 16/26 (2013.01); C23C 16/0281 (2013.01); C23C 16/545 (2013.01); Y10T 428/265 (2015.01); Y10T 428/30 (2015.01);
Abstract

Technologies are presented for growing graphene by chemical vapor deposition (CVD) on a high purity copper surface. The surface may be prepared by deposition of a high purity copper layer on a lower purity copper substrate using deposition processes such as sputtering, evaporation, electroplating, or CVD. The deposition of the high purity copper layer may be followed by a thermal treatment to facilitate grain growth. Use of the high purity copper layer in combination with the lower purity copper substrate may provide thermal expansion matching, compatibility with copper etch removal, or reduction of contamination, producing fewer graphene defects compared to direct deposition on a lower purity substrate at substantially less expense than deposition approaches using a high purity copper foil substrate.


Find Patent Forward Citations

Yager, Thomas. (2016). Copper substrate for deposition of graphene (U.S. Patent No. 9322096). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9322096

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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