The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
May. 01, 2012
Applicants:
Towako Takeishi, Kanagawa, JP;
Takujiro Yamabe, Kanagawa, JP;
Kyoko Takakuwa, Kanagawa, JP;
Inventors:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY, Saint Paul, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/32 (2006.01); C08K 7/28 (2006.01); C08K 5/544 (2006.01); C08L 23/10 (2006.01); C08L 77/02 (2006.01); C08L 77/06 (2006.01); C08K 9/06 (2006.01); C08K 9/08 (2006.01); C03C 11/00 (2006.01); C09C 3/10 (2006.01); C09C 1/28 (2006.01); C03C 17/30 (2006.01); C03C 17/32 (2006.01);
U.S. Cl.
CPC ...
C08K 7/28 (2013.01); C03C 11/002 (2013.01); C03C 17/30 (2013.01); C03C 17/32 (2013.01); C08K 5/544 (2013.01); C08K 9/06 (2013.01); C08K 9/08 (2013.01); C08L 23/10 (2013.01); C08L 77/02 (2013.01); C08L 77/06 (2013.01); C09C 1/28 (2013.01); C09C 3/10 (2013.01); C01P 2004/34 (2013.01);
Abstract
A thermoplastic resin composite with improved specific flexural strength, and a molded body containing the thermoplastic resin composite. A thermoplastic resin composite containing a resin component which is a polyamide resin or polypropylene resin, and hollow glass microspheres, wherein the hollow glass microspheres are surface treated with from 0.5 to 3 mass % of a silane coupling agent and from 1 to 5 mass % of a synthetic resin emulsion, based on 100 mass % of hollow glass microspheres.