The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2016
Filed:
Jan. 06, 2015
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Masashi Yoshiike, Fujimi-machi, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/04 (2006.01); B41J 2/14 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/02 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14 (2013.01); B41J 2/14233 (2013.01); B41J 2/164 (2013.01); H05K 1/0284 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/02 (2013.01); B41J 2002/14491 (2013.01); H01L 2224/16225 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10234 (2013.01);
Abstract
A wiring substrate includes a device substrate having a first surface, a sealing plate having a second surface superimposed on the first surface via an adhesive film and crossing the first surface, and wires set along the surfaces of the first surface, the adhesive film, and the second surface. The wiring substrate includes, between the wires adjacent to each other, a recessed section forming a recess with respect to a first bonding surface of the adhesive which is in contact with the first wire and a second bonding surface of the adhesive which is in contact with the second wire.