The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Jan. 17, 2014
Applicant:

Globe Machine Manufacturing Company, Tacoma, WA (US);

Inventors:

Ronald M. Jacobsen, Puyallup, WA (US);

Antonin Pelc, Milton, WA (US);

Calvin D. Bamford, Jr., Tacoma, WA (US);

Terrance William Cooke, Tacoma, WA (US);

Victor Wayne Croston, Port Orchard, WA (US);

Russell Carver Warrick, Seattle, WA (US);

Assignee:

Lightweight Labs, LLC., Tacoma, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/00 (2006.01); B29C 70/44 (2006.01); B29C 35/02 (2006.01); B32B 1/00 (2006.01); B32B 5/26 (2006.01); B32B 5/28 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/14 (2006.01); B65B 5/04 (2006.01); B29C 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 70/00 (2013.01); B29C 35/02 (2013.01); B29C 35/0227 (2013.01); B29C 70/443 (2013.01); B32B 1/00 (2013.01); B32B 5/26 (2013.01); B32B 5/28 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/14 (2013.01); B65B 5/04 (2013.01); B29C 31/006 (2013.01); B32B 2250/20 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/02 (2013.01); B32B 2262/101 (2013.01); B32B 2262/103 (2013.01); B32B 2262/105 (2013.01); B32B 2262/106 (2013.01); B32B 2305/076 (2013.01); B32B 2305/18 (2013.01); B32B 2305/77 (2013.01); B32B 2307/416 (2013.01); B32B 2605/08 (2013.01); B32B 2605/18 (2013.01); Y10T 29/49801 (2015.01); Y10T 29/53096 (2015.01); Y10T 29/53313 (2015.01); Y10T 428/12493 (2015.01); Y10T 428/12986 (2015.01); Y10T 428/239 (2015.01); Y10T 428/24992 (2015.01); Y10T 428/249921 (2015.04); Y10T 428/31678 (2015.04);
Abstract

A method for thermally processing and curing unprocessed components within a thermal processing and consolidation system which includes upper and lower chamber assemblies configured to couple to one another and a first tool, the method including positioning the first tool on the lower chamber assembly moving the lower chamber assembly relative to the upper chamber assembly and coupling the upper chamber assembly and the lower chamber assembly to form a plenum, thereby completely enclosing the first tool in the plenum, the plenum operable to maintain a pressurized and/or temperature controlled environment about the first tool, providing services to the first tool and the plenum via a service interface, and thermally processing and curing the first set of unprocessed components within the first tool wherein the services are supplied to the first tool as directed by a set of process parameters.


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